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昆明ROHS2.0报价 中国ROHS *
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RoHS是由欧盟立法制定的一项强制性标准，它的全称是《关于限制在电子电器设备中使用某些有害成分的指令》(Restriction of Hazardous Substances)。该标准已于2006年7月1日开始正式实施，主要用于规范电子电气产品的材料及工艺标准，使之更加有利于人体健康及环境保护。
RoHS一共列出十种有害物质包括：铅Pb，镉Cd，汞Hg，六价铬Cr6+，多溴二苯醚PBDE，PBB，DIBP，BBP,DBP,DEHP
哪些材质可以豁免
由于技术问题，部分材料或者产品的制造技术还做不到ROHS指令要求，在经过向欧盟的特殊申请后，以下项目可以获得豁免（部分豁免是有期限的）：
RoHS ExemptionsEU RoHS
Items Exemption Clauses
原有
1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2 Mercury in straight fluorescent lamps for general purposes not exceeding:
- halophosphate 10 mg
- triphosphate with normal lifetime 5 mg
- triphosphate with long lifetime 8 mg.
3 Mercury in straight fluorescent lamps for special purposes.
4 Mercury in other lamps not specifically mentioned in this Annex.
5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6 Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
7 - lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, **ling, transmission as well as network management for telecommunications
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations
9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
10 Lead used in compliant pin connector systems
11 Lead as a coating material for the thermal conduction module c-ring
12 Lead and cadmium in optical and filter glass
13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
15 DecaBDE in polymeric applications
16 Lead in lead-bronze bearing shells and bulbs
17 Lead in linear incandescent lamps with silicate coated tubes
18 Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications
19 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
20 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL)
21 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)
22 Lead and cadmium in printing inks for the application of enamels on borosilicate glass.
23 Lead as impurity in RIG (rare earth iron gamet) Faraday rotators used for fibre optic communication systems.
24 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames.
25 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
26 Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
27 Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
28 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
29 Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.
30Lead bound in crystal glass as defined in Annex I (Category 1,2,3 and 4) of Council Directive 69/493/EEC
新增
2009年6月11日，欧盟OJ刊登了2009/443/EC，新增了6项RoHS指令的豁免，分别如下：
33. Lead insolders for the soldering of thin copper wires of 100 μm diameter andless in power transformers. 电力变压器中直径100微米及以下细铜线所用焊料中的铅
34. Lead in cermet-based trimmer potentiometer elements. 金属陶瓷质的微调电位计中的铅
6月5，欧盟刊登了2009/428/EC，从2011年1月1日起，将原豁免的*22点“光纤通讯系统稀土铁石榴石法拉*旋转器中作为杂质的铅”从豁免列表中移除。
东莞市信准检测技术服务有限公司与深圳市华商检测技术有限公司达成战略合作伙伴关系，深圳市华商检测技术有限公司所发信息中的测试与检测由东莞市信准检测技术服务有限公司测试与检测，报告由东莞市信准检测技术服务有限公司出具。
RoHS是由欧盟立法制定的一项强制性标准，它的全称是《关于限制在电子电器设备中使用某些有害成分的指令》(Restriction of Hazardous Substances)。该标准已于2006年7月1日开始正式实施，主要用于规范电子电气产品的材料及工艺标准，使之更加有利于人体健康及环境保护。
RoHS一共列出十种有害物质包括：铅Pb，镉Cd，汞Hg，六价铬Cr6+，多溴二苯醚PBDE，PBB，DIBP，BBP,DBP,DEHP
哪些材质可以豁免
由于技术问题，部分材料或者产品的制造技术还做不到ROHS指令要求，在经过向欧盟的特殊申请后，以下项目可以获得豁免（部分豁免是有期限的）：
RoHS ExemptionsEU RoHS
Items Exemption Clauses
原有
1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2 Mercury in straight fluorescent lamps for general purposes not exceeding:
- halophosphate 10 mg
- triphosphate with normal lifetime 5 mg
- triphosphate with long lifetime 8 mg.
3 Mercury in straight fluorescent lamps for special purposes.
4 Mercury in other lamps not specifically mentioned in this Annex.
5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6 Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
7 - lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, **ling, transmission as well as network management for telecommunications
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations
9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
10 Lead used in compliant pin connector systems
11 Lead as a coating material for the thermal conduction module c-ring
12 Lead and cadmium in optical and filter glass
13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
15 DecaBDE in polymeric applications
16 Lead in lead-bronze bearing shells and bulbs
17 Lead in linear incandescent lamps with silicate coated tubes
18 Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications
19 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
20 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL)
21 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)
22 Lead and cadmium in printing inks for the application of enamels on borosilicate glass.
23 Lead as impurity in RIG (rare earth iron gamet) Faraday rotators used for fibre optic communication systems.
24 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames.
25 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
26 Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
27 Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
28 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
29 Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.
30Lead bound in crystal glass as defined in Annex I (Category 1,2,3 and 4) of Council Directive 69/493/EEC
新增
2009年6月11日，欧盟OJ刊登了2009/443/EC，新增了6项RoHS指令的豁免，分别如下：
33. Lead insolders for the soldering of thin copper wires of 100 μm diameter andless in power transformers. 电力变压器中直径100微米及以下细铜线所用焊料中的铅
34. Lead in cermet-based trimmer potentiometer elements. 金属陶瓷质的微调电位计中的铅
6月5，欧盟刊登了2009/428/EC，从2011年1月1日起，将原豁免的*22点“光纤通讯系统稀土铁石榴石法拉*旋转器中作为杂质的铅”从豁免列表中移除。
东莞市信准检测技术服务有限公司与深圳市华商检测技术有限公司达成战略合作伙伴关系，深圳市华商检测技术有限公司所发信息中的测试与检测由东莞市信准检测技术服务有限公司测试与检测，报告由东莞市信准检测技术服务有限公司出具。
