loctite乐泰UF3808电子胶水 底部填充胶 50ml

供应乐泰UF3808胶水，乐泰77B胶水，loctiteUF3808
汉高乐泰UF3808胶水，BGA底部填充，loctite UF3808，50ml

汉高乐泰UF3808胶水，底部填充胶
 
Hysol UF3808高性能底部填充环氧胶，产品为单组份
 
乐泰3808具有高Tg ,低热膨胀系数，快速热固化的性能，不含卤素，和绝大多数无铅锡高具有很好的相容性。
 
Hysol UF 3808具有很稳定的电学性能，耐温度冲击和潮气性能俱佳，同时还具有再加工性能。 
应用于BGA和芯片堆叠封。
 
乐泰UF3808基本理化指标 黏度360 CPS比重1.16 g/cm3开放时间25°C,（以黏度上升25%为判断基准 ）3天保存期 （在-20°C下）

UF3808 provides the following product characteristics:
Technology Epoxy Appearance Black liquid Product Benefits
● High Tg
● Low CTE
● Reworkable
● Halogen free
● One component
● Room temperature flow capability
● Fast cure at moderate temperatures
● Compatible with most Pb-free solders
● Stable electrical performance in Temperature Humidity Bias Cure Heat cure Application Underfill Typical Package Application Chip stack packages and BGA UF3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties

深圳市汉达乐泰胶水有限公司  0-7-5-5-2-8-2-2-8-5-5-6   134-2379-0076  刘凯