Akrometrix加热翘曲测量仪接口分析Interface Analysis

Akrometrix加热翘曲测量仪接口分析Interface Analysis


Akrometrix iawpwf_croppedsoftware：理解加热翘曲在两个配合表面之间
cores加热、测量、分析、报告全程实现自动化,不需前处理；3D快速扫描,连续快速测量整个平面,并能获取准确的数据，3D技术记录全过程的平面翘曲变化,系统自动实时测试分析翘曲数据,并形成影像,可以产生数据完备的动态报告、静态报告.

Akrometrix加热翘曲测量仪接口分析Interface Analysis
表面贴装元件在回流焊过程中翘曲，以及它们所连接的区域在装配过程中也改变形状。此组件之间的接口是焊料，粘贴和间隙创建由于热膨胀结合起来，创造**个良好的产品，或缺陷，如头在枕头，短裤，并打开。充分认识到，表面之间的关键接口比以往任何时候都更重要。
而标准Akrometrix软件允许一个人表面的分析，如PCB、BGA、接口分析是新的软件，使3D，2D，和一个完整的接口统计评论。用户现在可以可视化和量化到底是如何两个表面将队友在一起。通过结合此功能与在回流焊过程中的每个温度点上的测量表面的能力，焊点的形成或故障可以预测更*。
提供的任何250 + thermoiré系统使用遍布**电子供应链的今天，数据接口分析。引入*特的功能，如通/警告/故障图，和各种间隙和表面计信息，接口分析，让用户看到什么是发生在两个动态表面之间通过回流过程。

Akrometrix加热翘曲测量仪接口分析Interface Analysis应用包括SMT装配规划和故障诊断、失效分析、供应商的资质和比较，进行SPC，包装设计和有限元分析模型的验证两个重要应用领域
包装设计和装配的软件包
许多技术论文描述翘曲为流行设计的关键
更薄的设备导致更薄的流行层
**部和底部翘曲的附加表面是关键
在所有温度下的界面分析允许“*”的形状比较
用户可以在地图上设置限制时和“看”的问题
更多的层（如破皮）使翘曲更重要
封装到电路板的设计和装配
从IPC技术论文头枕缺陷：
“对一个供应商问题的主要贡献者是BGA组件的完整性。主要部件的完整性问题，有助于头枕的缺陷是产品制造业回流过程中构件的翘曲。如果组件在焊接过程中开始翘曲，组件球将从焊料膏和不湿的散装焊料分开。元件封装设计、材料和完整性都有助于部分潜在的翘曲。内部验证试验应了解潜在的组件的翘曲到新方案实施到制造过程之前。”
接口分析与两个阴影莫尔é和DFP的数据集，可以混合和匹配的数据从两种技术。



相关产品
CORES 平面度测量/平整度测试/加热翘曲测量 
core9012a/core9031a/core9032a/core9037a/core9038a/core9045a/core9046a/core9050b/core9055a/core9060a/core9070a/core9100a
Akrometrix平面度测量/平整度测试/加热翘曲测量
AXP-300x233/Convective-Module-Tower/CRE6 Module/CXP/DFP Module/DIC 2.0 Module/Digital Fringe Projection/Digital Image Correlation/Akrometrix Interface Analysis/Akrometrix Part Tracking/PS200S/PS600S/Real Time Analysis/Akrometrix Shadow Moiré/Akrometrix Studio Platform




Interface Analysis
IAwPWF_CroppedSoftware: Understanding Warpage Between Two Mating Surfaces

Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create ** good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.

While standard Akrometrix software allowed the analysis of an individual surface, such as a PCB or BGA, Interface Analysis is new software that enables 3D, 2D, and statistical review of a complete interface. Users can now visualize and quantify exactly how two surfaces will mate together. By combining this feature with the ability to measure surfaces at each temperature point during reflow, solder joint formation or failure can be predicted much more easily.

Interface Analysis works with data supplied by any of the 250+ TherMoiré systems in use throughout the worldwide Electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and various gap and surface gauge information, Interface Analysis lets users see what is happening between two dynamic surfaces through the reflow process. Applications include SMT Assembly Planning and Troubleshooting, Failure Analysis, Supplier Qualification and Comparison, Ongoing SPC, Package Design, and FEA Modeling Validation

 

Two Important Application Areas

Package-on-Package Design and Assembly

Many Technical Papers describe warpage as critical to PoP design
Thinner Devices lead to thinner PoP layers
Warpage of Top and Bottom ‘Attach’ Surfaces is Critical
Interface Analysis allows ‘easy’ shape comparison at all temperatures
User can set Limits and ‘see’ problem areas in PWF Maps
More Layers (such as with PoPi) make warpage more important
Package-to-PCB Design and Assembly

From Head-in-Pillow defect IPC technical paper:
“One of the major contributors to the supplier issues is the integrity of the BGA component. The main component integrity issue that contributes to head-in-pillow defects is component warpage during the product manufacturi